Source: LogicFolding-No-Action-Decision-Memo.pdf (v4.1, 2026-05-27, 16 pages). LaTeX source + figure-generation script in memo-source/.
This index maps the codebase to the memo so anyone reviewing the implementation can verify it faithfully encodes the memo's equations rather than reinterpreting them. The memo itself is bundled in this repository under the same docs/ directory.
| Memo eq. | File:line | Notes |
|---|---|---|
| Eq. 2 (path break-even) | python/src/logic_folding_reference/core_solver.py:VerticalPathEvaluator.evaluate |
Full form with R_v·C_v and R_b·C_b self-loading terms |
| Eq. 2 (path break-even) | rust/src/lib.rs:PathEvaluator::evaluate |
Note: per the user-provided Rust task spec, omits R_v·C_v / R_b·C_b self-loading; see code comment |
| Eq. 3 (thermal kernel) | julia/src/thermal_apc_solver.jl:calculate_thermal_profile |
FFT-based spatial convolution |
| Eq. 4 (APC state-space) | julia/src/thermal_apc_solver.jl:run_apc_simulation |
Time-varying A_k, B_k, C_k with variable delay d_k |
| Eq. 5 (value score) | not implemented (out of scope for v0) | Memo §10 — see future-work in README |
- Memo §7: "If only very long global paths pass, the approach may be a niche floorplanning technique, not a standard-cell-level scaling law." —
core_solver.pyreports per-path margins so callers can stratify byl_hthemselves. - Memo §8: "the same chip can pass burst benchmarks and fail sustained workloads. Therefore burst scores are not investment evidence." —
thermal_apc_solver.jlworkloads default to >= 10-minute sustained pulses. - Memo §9: "Spatial APC for folded 3D logic under sparse delayed metrology is not merely a missing parameter; it is an unsolved control problem." — APC code is illustrative, demonstrates divergence, does not claim to be a portability proof. Matches memo's stance.
Per memo §6, this codebase addresses Trigger C: Open reference flow ("Open-source 3D-native partitioning and proxy signoff runnable on public PDKs and benchmarks"). It does not address Triggers A (shipping teardown) or B (foundry disclosure).